SURFACE MOUNT TECHNOLOGY

At our partner factory site, the latest technologies are incorporated:

Fuji CP643E, FCP-IV-3 Pick and Place Machine - High Speed Chip Shooter

PCB Dimensions:
Max 457x356mm (18" x 14") Min 80x50mm
Device Inputs:
160 - 8mm Feeder Locations
Rated Placing Speed:
0.15 seconds/part - 24,000
CPH?0402 Ready
Twelve Placement Heads with 3 Nozzles/Head
Two Device Tables with 80 Feeder Location Each

Fuji XP 143 Pick and Place Machine - Chip Shooter

PCB Dimensions: Max: 508mm x 457mm Min: 80mm x 50mm
Thickness: 0.5mm x 4.0mm
Component Capacity: Up To 100 types (using 8 mm tape feeders.)
PCB loading Time: 4.2 sec.
Placing accuracy
Chips: ±0.05mm(3 Sigma),±0.1mm(6 Sigma)
QFPs: ±0.03mm(3 Sigma),±0.06mm(6 Sigma)
Applicable Components:
0603 (0201) to 20 x 20 mm, Max height 6.0 mm

PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm
Board Thickness: 0.3 to 4.0 mm
Component capacity Up to 140 types (8mm tape)
PCB loading time 0.7 sec./PCB with double PCB loading 1.4 sec./PCB with single PCB loading
Loading time does not include X-Y table movement.
Double PCB loading is possible upto 220mm in length
Placing rate 0.09 sec./component - 40,000 CPH
Applicable components 0402 to 19 x 20 mm
Maximum Component Height: 6mm
Placing Accuracy ± 0.01mm (3 s)

Fuji CP642 Pick and Place Machine - High Speed Chip Shooter

PCB dimensions Max:
457mm x 356mm Min: 80mm x 60mm
Board Thickness:
0.3 to 4.0mm
Component capacity Up to 140 types (8mm tape)
Placing rate 0.09 sec./component - 40,000 CPH
Applicable components 0402 to 19 x 20mm
Maximum Component Height:
6mm

DEK HORIZON 03iX SCREEN PRINTERS

Accuracy and Repeatability: 1.33 Cpk @ +/- 25 m
Cycle Core Time: 14 seconds
Max. Board Size (Print Area): 508mm (X) x 508mm (Y)
Print Speed: 2mm to 150mm/sec
Squeegee Pressure Mechanism: Software controlled, motorised
Tooling: Magnetic tooling pins
Camera: Graphite digital camera, using IEEE 1394 interface. Single channel.
Fiducial Recognition: Automatic fiduicial teach and find
Operating System: Windows XP
Operator Interface: Colour TFT display, kb and trackball with DEK Instinctiv software
Stencil Loading: Manual with screen depth adjuster
Stencil Alignment: Motorised via actuators X, Y and Theta
Machine Interface: Upline and downline FMI included
Squeegee: Clamped double trailing edge squeegee (1 set included)

DEK HORIZON 02iX SCREEN PRINTERS

DEK HORIZON 01iX SCREEN PRINTERS

Heller 1809 MKIII, 1809EXL, 1913 MKIII Reflow Ovens

Windows XP
Left to Right
13 Heating Zones,
4 Cooling zones
Edge Rail only
No Center Support
Nitrogen
Lead free
Belt speeds up to 1.4m/min
Highest levels of repeatability with the lowest delta Ts
Most efficient heat transfer
Wide process window for "universal profiling"
Advanced 5 thermocouple PCB profiling

Fuji XP243 IC Mounters

PCB Dimensions:
Max 457mm x 356 mm
Min: 80mm x 50mm
Thickness: 0.3 to 4.0 (including option)
*Component Capacity:
Feeders - 40 Types using 8mm tape feeders
Trays - 10 types on 10 shelves
*PCB loading time
4.2 sec.
*Fuji XP-243 Placing Rate:
CHIPS 0.43 Sec/comp.
ICs from 0.56 Sec / Comp.
*Fuji XP-243 Placing accuracy:
CHIPS ±0.05mm(3 Sigma) ±0.1mm(6 Sigma)
QFPs ±0.03mm(3 Sigma) ±0.06mm(6 Sigma)
Applicable Components:
0201 to 45 X 150mm Max height 25.4mm

THRU-HOLE TECHNOLOGY

HEXI Lead-Free Wave Solder Machine (WS-350PC-LF)

Automatic Dual Wave

Automatically completing flux, preheating, soldering and cooling
Many protection devices and modularized design with high reliability and automatization
Two waves can be controlled separately by transducer, suitable for all types of PCB.

Flux spraying system can be maintained easily with long life.
Flux is airproofed without volatilization, pollution and maintenance.
Spraying area can be adjusted automatically according to the size of PCB, or set manually.

Preheating system and soldering system are controlled by PID&SSR with high precision.
Two preheating zones are controlled separately to ensure high soldering technics..
Conveyor system is controlled by gear motor through PID with stable speed.
Width adjustment pole with protection cover avoids pollution and distortion.
Economically working can reduce oxidation.

Equipped with light and sound alarm, urgency stop system and overload protector.
Heat compensation and cooling system meet the demand of lead-free soldering and process.